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TECHNICAL NOTE
Motor Driver IC Series for Printers
DC Brush Motor Driver for Paper Feed or Carriage Use
BA6920FP-Y, BA6219BFP-Y
Description The BA6920FP-Y and BA6219BFP-Y are full-on drivers for motors with DC brushes. They operate in forward rotation mode, reverse rotation mode, stop (idling) mode, or brake mode, that are selectable according to the input logic (two inputs). The output voltage can be set through the output voltage setting pin.
Features 1) Large output current. (BA6219BFP-Y) 2) Built-in thermal shutdown circuit 3) The output voltage can be set flexibly through the output voltage setting pin. 4) Built-in standby (stop) circuit. (BA6920FP-Y)
Applications Devices that use DC brush motors, such as photo printers, scanners, mini printers, and fax machines.
Absolute maximum ratings Parameter Symbol VCC1, 2, Applied voltage VM, VCC Power dissipation Operating temperature range Storage temperature range Output current Junction temperature ** Must not exceed Pd or ASO. 500s pulses at a duty of 1/100. Pd Topr Tstg IOmax Tjmax *1450 -25+75 -55+150 2200** 150 36 *1450 -30+85 -55+150 1000** 150 V mW mA 24 Limit BA6219BFP-Y BA6920FP-Y V Unit
* Reduced by 11.6 mW/C over 25C, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).
Operating conditions BA6219BFP-Y Parameter Power supply voltage BA6920FP-Y Parameter Power supply voltage Symbol VCC VM Operating voltage 6.534 6.534 Unit V V Symbol VCC1,2 Operating voltage 818 Unit V
Ver.B Oct.2005
Electrical characteristics BA6219BFP-Y (Unless otherwise specified, Ta=25C, VCC1=12 V, VCC2=12 V) Parameter Circuit current 1 Circuit current 2 Circuit current 3 High-level input voltage Low-level input voltage VR bias current CD1 constant-current value CD2 constant-current value Output leak current FOUT high output voltage FOUT low output voltage ROUT high output voltage ROUT low output voltage Symbol ICC1 ICC2 ICC3 VIH VIL IVREF ICD1 ICD2 IOL VHF VLF VHR VLR Limit Min. 3.0 0 0.6 0.7 0.7 6.5 6.5 Typ. 1.2 16 25 1.2 1.5 1.5 Max. 2.5 35 60 VCC 1.0 2.4 3.0 3.0 1 1.2 1.2 Unit mA mA mA V V mA mA mA mA V V V V RL=60 (IN1, IN2) = (H, L): Current from CD1 to GND (IN1, IN2) = (H, L): Current from CD2 to GND (IN1, IN2) = (L, L): Current flowing into VCC2 RL=60 VR=6.8V RL=60 VR=6.8V RL=60 VR=6.8V RL=60 VR=6.8V Standby mode (stop) Forward rotation or reverse mode Brake mode Conditions
BA6920FP-Y (Unless otherwise specified, Ta=25C, VCC1=12 V, VM=12 V) Parameter Circuit current 1 Circuit current 2 Circuit current during standby mode High-level input voltage Low-level input voltage High-level input current Output saturation voltage Power saving off voltage Power saving on voltage REF bias current Symbol ICC1 ICC2 IST VIH VIL IIH VCE VPS OFF VPS ON IREF Limit Min. 5 3 3.0 100 2.0 Typ. 8 5 200 2.2 12 Max. 12 8 15 0.8 300 3.3 0.8 35 Unit mA mA A V V A V V V A VIN=3.0V Io = 200 mA: Total voltage of both high and low sides of output transistor Operating mode Standby mode VREF=6V,Io=100mA Conditions Forward rotation or reverse mode Brake mode Standby mode
I/O Logic table BA6219BFP-Y IN1 H L H L BA6920FP-Y FIN H L H L Don't Care RIN L H H L Don't Care POWER SAVE L L L L H OUT1 H L L OPEN (Hi-Z) OPEN (Hi-Z) OUT2 L H L OPEN (Hi-Z) OPEN (Hi-Z) Mode Forward rotation Reverse rotation Brake Stop Power saving mode (Output stop) IN2 L H H L OUT1 H L L OPEN(Hi-Z) OUT2 L H L OPEN(Hi-Z) Mode Forward rotation Reverse rotation Brake Stop
Note: When the POWERSAVE pin is at high level, OUT1 and OUT2 will be open regardless of the FIN or RIN logic.
2/8
Reference data
2 Circuit Current:Icc1[mA]
30
IN1=IN2=L VCC1=VCC2
Circuit current :Icc2[mA]
1.5
Circuit current:Icc3[mA]
-25
25 20 15 10 5 0
IN1=L, IN2=H VCC1=VCC2 -25
40
IN1=IN2=H VCC1=VCC2
-25
30
1
75 25
20
75 25
25
75
0.5
10
0 8 10 12 14 16 18
0
8 10 12 14 16 18
8
10
12
14
16
18
Supply Voltage:Vcc[v]
Supply Voltage :Vcc[v]
Supply Voltage:Vcc[v]
Fig. 1 Circuit current 1 (Standby) (BA6219BFP-Y)
Fig. 2 Circuit current 2 (Reverse rotation) (BA6219BFP-Y)
Fig. 3 Circuit current 3 (Brake) (BA6219BFP-Y)
15 12
Circuit current:Icc1[mA]
Circuit current:Icc2[mA]
12 9
Output H Voltage:VOH[V
FIN=H, RIN=L VCC=VM -30 25
15
FIN=H, RIN=H VCC=VM
7.5
VCC1= VCC2=12 VREF=6.8V
7.25
9 6
75
7
-30
6 3
25 -25
85
3 0 5 10 15 20 25 30 35
6.75
25
85
0 5 10 15 20 25 30 35
6.5 0 0.5 1 1.5 2
Supply Voltage:Vcc[v]
Supply Voltage:Vcc[v]
Output Current:Iout[A]
Fig. 4 Circuit current 1 (Forward rotation) (BA6920FP-Y)
Fig. 5 Circuit current 2 (Brake) (BA6920FP-Y)
Fig. 6 High Output vs Output Current (BA6219BFP-Y)
-0.1
2.4
Output L Voltage:VOL[V
Output H Voltage:VOH[V]
Output L Voltage:VOL[V]
2.0 1.6 1.2 0.8 0.4 0.0
VCC1=VCC2=12V VREF=5V 75
1.4 1.2 1.0 0.8
-0.5 -0.9
75
85
-1.3 -1.7
25 -25
25
0.6 0.4 0.2 0.0
25
-30
-30
-2.1 0 0.2 0.4 0.6 0.8 1
0
0.5
1
1.5
2
0
0.2
0.4
0.6
0.8
1
Output Current:Iout[A]
Output Current:Iout[A]
Output Current:Iout[A]
Fig. 7 High Output vs Output Current (BA6920BFP-Y)
Fig. 8 Low Output vs Output Current (BA6219BFP-Y)
Fig. 9 Low Output vs Output Current (BA6920AFP-Y)
Pin assignment
BA6219BFP-Y
(GND) OUT1 OUT2 VREF RIN N.C. GND N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. (GND) POWER SAVE FIN VCC VM N.C.
BA6920FP-Y FIN
GND
VCC1
VCC2
N.C.
CD2
FIN
N.C.
N.C.
IN2 N.C.
N.C.
GND
N.C.
GND OUT1
N.C.
N.C.
N.C.
N.C.
CD1
N.C
OUT2
RNF
IN1
(GND)
Fig.10
Fig.11
3/8
(GND)
FIN
FIN
N.C.
VR.
N.C
N.C. N.C.
N.C. N.C.
N.C.
Block diagram
BA6219BFP-Y
Current limiting resistor
BA6920FP-Y
Current limiting resistor
- 1100F +
510 VR ZD IN1 LOGIC IN2 VCC1 VCC2
- 1100F
For preventing upper and lower transistors from turning on simultaneously POWER 0.011F SAVE 0.1F CD1 RIN
LOGIC
+
VCC1
510
VM
POWER
CONTROL
FIN TSD OUT2 CD2 0.1F For output oscillation prevention 0.010.1F GND
CONTROL
OUT1 MOTOR 0.01F
OUT1 MOTOR 0.01F OUT2
TSD
GND For preventing upper and lower transistors from turning on simultaneously 0.011F
VREF
RNF ZD
Fig.12
For output oscillation prevention 0.010.1F
Fig.13
Explanation of external components Capacitors that prevent upper and lower transistors from turning on simultaneously (Capacitors to connect to CD1 and CD2 pins in the case of BA6219BFP-Y). The rising of the base potential of the transistor at high-level output is delayed to prevent both transistors from turning on simultaneously. Set the capacitance between 0.01F and 1F and ensure that a penetration current does not flow during output mode changes, since the transistors do not turn on simultaneously. Capacitor for output oscillation prevention The output pin may generate noise or oscillate, depending on the set mounting conditions, such as the power supply circuit, motor characteristics, and PCB pattern artwork. Connect a capacitor with a capacitance value of 0.01F to 0.1F to prevent noise oscillation. Resistance for current limiting A resistor used to prevent collector loss and limit the current of output shorting. Although the required resistance varies with the supply voltage, a resistance of approximately 5 to 10 should be selected. When designing the circuit, pay utmost attention to voltage reduction resulting from a rush current that flows when the driving of the motor starts. Zener diode for output voltage setting Zener diode for high output voltage VR (VREF) setting. The zener voltage can be set almost equal to high output voltage.
BA6219BFP-Y PIN No. 2 4 6 7 8 10 11 13 15 19 20 24 FIN Pin Name CD1 VR IN1 GND IN2 VCC1 VCC2 CD2 OUT2 GND GND OUT1 GND Function Capacitor connection pin for prevention of upper and lower transistors to turn on simultaneously High output voltage setting pin Logic input pin GND Logic input pin Power supply pin for small signal block Power supply pin for motor output Capacitor connection pin for prevention of upper and lower transistors to turn on simultaneously Motor output pin GND GND Motor output pin Note: Be sure to connect the heat dissipation fin to the GND pin.
BA6920FP-Y Pin No 5 6 8 9 16 17 18 19 20 21 FIN Pin name OUT2 RNF GND OUT1 VM Vcc FIN POWER SAVE RIN VREF GND Function Motor output pin Connection pin for output current detection on the GND pin of the output block GND Motor output pin Motor power supply Power supply pin Logic input pin Power saving input pin Logic input pin High output voltage setting pin Note: Be sure to connect the heat dissipation fin to the GND pin.
Note: Pins 1 to 4, 7, 10 to 14, and 20 to 24 are NC pins.
Note: Pins 1, 3, 5, 9, 12, 14, 16 to 18, 21 to 18, 21 to 23, and 25 are NC pins.
4/8
IC Operation BA6920FP-Y(BA6219BFP-Y) 1) I/O mode of input block FIN (IN1) and RIN (IN2) A pin where control signals are input. Each mode operates as explained below. When the FIN (IN1) is set to high and RIN (IN2) is set to low, the forward rotation mode will be set and a current will flow from OUT1 to OUT2. When the FIN (IN1) is set to low and RIN (IN2) is set to high, the reverse rotation mode will be set and a current will flow from OUT2 to OUT1. When both FIN (IN1) and RIN (IN2) are set to high, the brake mode will be set. At that time, the output transistor on the high side will be turned off to stop the supply of the motor drive current while the output transistor on the low side will be turned on to absorb the motor back EMF to brake the motor. When both FIN (IN1) and RIN (IN2) are set to low, OUT1 and OUT2 will be both open potential and the motor will stop. 2) High output voltage setting function With this function, the output voltage can be set through the high output voltage setting pin in order to control the rotation speed of the motor. If the high output voltage is set to a lower value, the power consumption of the IC will become high. Consider the power dissipation (Pd) of the IC under actual operating conditions, and implement thermal designing with a sufficient margin. 2-1. BA6219BF-Y (See Fig.14) High output voltage is expressed by the following equation. VoutH (high output voltage) = VR + {VF(Q5) + VF (Q6) + VF (Q7) - VF (Q2) -VF (Q3) - VF (Q4)} VR +VF (VF is the base-emitter voltage in the forward direction) Although VF depends on the output current, Vo is almost VR. The maximum value VoutHmax of high output voltage that can be set is as follows. VoutHmax < VCC1 - Vsat (Q1) - VF (Q2) - VF (Q3) - VF (Q4) VCC1 - 2.5 V Relation of VCC1, VCC2, and VR VCC1, VCC2, and VR should be set as follows. VR < VCC2 - Vsat (Q3) + VF (Q3) + VF (Q2) - {VF (Q5) + (Q6) + (Q7)} VCC2 - 1 V Operating Conditions Pin VCC1 VCC2 VR Voltage 8 18 8 18 Shown above Unit V V VR (VREF) voltage High output voltage
VCC1 VCC2
Q1 Q2 Q3 Q5 Q6 Q7
Q4
OUT VR Fig.14
2-2. BA6920FP-Y (See Fig. 16) High output voltage is expressed by the following equation: VoutH (high output voltage) = Vref voltage + {VF (Q2) + VF( Q3)} - {VF(Q4) + VF (Q5)} Vref voltage +VF (VF is the base-emitter voltage in the forward direction) Although VF depends on the output current, Vo is almost VR. The VOH is beyond control if the Vref value is higher than the above, and determined by the voltage condition of VCC and VM. For example, when Vref = VCC VCC - 1.7 V Relation of VCC, VM, and VREF VCC1, VCC2, and VR should be set as follows. VREF < VM - Vsat (Q5) + VF (Q5) + VF (Q4) - {VF (Q2) + (Q3)} VM - 0.3 V Operating conditions pin VCC VM VREF Voltage 6.5 34 6.5 34 Shown above Unit V V VREF Fig.16 Q2 Q3 OUT Q4 Q5 = VM, Q1 VM VOHVCC - Vsat (Q1) - VF (Q4) -VF (Q5) VCC Output Voltage Control Range Fig.15
3 ) Selection of forward or reverse rotation To change the rotation direction of the motor in operation, be sure to brake or open the motor current on time. In the above case, Braking: The braking time or over. The braking time is defined as the time of setting the output low level voltage to the GND potential or below, when the brake operates. Opening: A period of 1 ms or over is recommended.
5/8
Power Dissipation Reduction (Common) Pd[] 2.0 1.5 1.45 1.0 0.5
0
25
50
75 85 100
125
150 Ta[]
Fig.17
When mounted on a glass epoxy board with a dimension of 70 mm x 70 mm x 1.6 mm. Reduced by 11.6 mW/C over 25C. Must not exceed Pd or ASO.
I/O Circuit Diagram Input (BA6219BFP-Y) Input (BA6920FP-Y)
20k FIN RIN IN1,IN2 10k 10k 10k
11k
13.2k
4.7k 11k 20k 10k
Fig.18 Output (BA6219BFP-Y) CD1 VCC2 CD2 Output (BA6920FP-Y)
GND
Fig.19
VCC Q1 Q4 VCC1 Q5 Q2 VR OUT1 OUT2 GND Q3 VREF
VM
OUT2
OUT1
RNF GND Fig.20 Fig.21
Operation Notes 1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added.
6/8
3)
Power supply lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, note that capacitance characteristic values are reduced at low temperatures.
4) 5) 6)
GND voltage The potential of GND pin must be minimum potential in all operating conditions. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together.
7) 8) 9)
Actions in a strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. TSD on temperature [C] (Typ.) BA6680FS BD6761FS BD6762FV 175 175 175 Hysteresis temperature [C] (Typ.) 25 35 23
10)
PWM drive Voltage between the output FET drain and source may exceed the absolute maximum ratings due to the fluctuation of VCC at the time of PWM driving. If there is the threat of this problem, it is recommended to take physical countermeasures for safety such as inserting the capacitor between the VCC pin of FET and the detection resistor pin.
11)
Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. discharge capacitors after each process or step. transporting or storing the IC. or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Always Always turn the IC's power supply off before connecting it to or removing it from a jig Use similar precaution when
12)
Regarding input pin of the IC (Fig. 22) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Resistor Pin A Pin A
N N P+ P P+ N N
Transistor (NPN) Pin B
C B E B P P+ N C E
Pin B
Parasitic element
P+
N
P substrate Parasitic element
GND
P substrate Parasitic element Fig.22 Example of IC structure
GND GND GND
Parasitic element Other adjacent elements
13)
Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
7/8
Selecting a model name when ordering
B
A
6
9
2
0
F
P
-
Y
E
2
ROHM model name
Part number
Package type
Taping type E2 = Reel-wound embossed taping
HSOP25

Tape
13.6 0.2
25
Embossed carrier tape 2000pcs E2
(Correct direction: 1pin of product should be at the upper left when you hold reel on the left hand, and you pull out the tape on the right hand)
Quantity
14
2.75 0.1
7.8 0.3
5.4 0.2
1
1.95 0.1 0.8
13
0.25 0.1
1.9 0.1
0.11
0.1 0.36 0.1
0.3Min.
Direction of feed
1234
1234
1234
(Unit:mm)
Reel
1Pin
The contents described herein are correct as of October, 2005 The contents described herein are subject to change without notice. For updates of the latest information, please contact and confirm with ROHM CO.,LTD. Any part of this application note must not be duplicated or copied without our permission. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams and information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. The products described herein utilize silicon as the main material. The products described herein are not designed to be X ray proof.
1234
Orders are available in complete units only.
1234
Direction of feed
1234
1234
Published by Application Engineering Group
Catalog No.05T333Be '05.10 ROHM C 1000 TSU
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the NOTES specified in this catalog.
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